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 2SD1974
Silicon NPN Epitaxial
REJ03G0797-0200 (Previous ADE-208-1161) Rev.2.00 Aug.10.2005
Application
Low frequency power amplifier
Outline
RENESAS Package code: PLZZ0004CA-A (Package name: UPAK R ) 1 3 2
2, 4 1. Base 2. Collector 3. Emitter 4. Collector (Flange) ID
4
1
3
Note:
Marking is "ES". *UPAK is a trademark of Renesas Technology Corp.
Absolute Maximum Ratings
(Ta = 25C)
Item Symbol Collector to base voltage VCBO Collector to emitter voltage VCEO Emitter to base voltage VEBO Collector current IC Collector peak current ic (peak) E to C diode forward current ID Collector power dissipation PC*1 Junction temperature Tj Storage temperature Tstg Note: 1. Value on the alumina ceramic board (12.5 x 20 x 0.7 mm) Ratings 25 25 6 0.8 1.5 0.6 1.0 150 -55 to +150 Unit V V V A A A W C C
Rev.2.00 Aug 10, 2005 page 1 of 5
2SD1974
Electrical Characteristics
(Ta = 25C)
Item Collector to base breakdown voltage Collector to emitter breakdown voltage Collector to emitter sustaining voltage Emitter to base breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector to emitter saturation voltage E to C diode forward voltage Notes: 1. Pulse test Symbol V(BR)CBO V(BR)CEO VCEO(sus) V(BR)EBO ICBO ICEO IEBO hFE VCE(sat) VD Min 25 25 25 6 -- -- -- 250 -- -- Typ -- -- -- -- -- -- -- -- -- -- Max -- 35 35 -- 0.2 0.5 0.2 1200 0.4 1.5 Unit V V V V A A A V V Test conditions IC = 10 A, IE = 0 IC = 1 mA, RBE = IC = 0.8 A, RBE = , L = 20 mH IE = 10 A, IC = 0 VCB = 20 V, IE = 0 VCE = 20 V, RBE = VEB = 5 V, IC = 0 VCE = 2 V, IC = 0.1 A*1 IC = 0.8 A, IB = 80 mA*1 ID = 0.6 A*1
Rev.2.00 Aug 10, 2005 page 2 of 5
2SD1974
Main Characteristics
Maximum Collector Dissipation Curve Area of Safe Operation
10
Collector Power Dissipation PC (W) (on the alumina ceramic board)
1.2
Collector Current IC (A)
3 iC(peak) 1.0 IC(max) 0.3 0.1 0.03 0.01 0.01 Ta = 25C 1 Shot Pulse 0.3 1.0 3 10 30 100
PW =
0.8
10
1 m
D
m
s
C
s
O
pe
ra
tio
0.4
n
0
50
100
150
Ambient Temperature Ta (C)
Collector to Emitter Voltage VCE (V)
Area of Safe Operation of Emitter to Collector Diode
10 1.0 Ta = 25C 1 Shot Pulse
Typical Output Characteristics
Collector Current IC (A)
Diode Current ID (A)
8
0.8
1.8 1.6 1.4 1.2
1.0
0.8
6
0.6
4
0.4
0.6 0.4
2
0.2
0.2 mA
IB = 0 Ta = 25C
0 0.1
0.3
1.0
3
10
0
2
4
6
8
10
Pulse Width PW (ms)
Collector to Emitter Voltage VCE (V) Saturation Voltage vs. Collector Current
Typical Transfer Characteristics
1.0
Collector to Emitter Saturation Voltage VCE(sat) (V) Base to Emitter Saturation Voltage VBE(sat) (V)
10 3 1.0 0.3 0.1
t)
Collector Current IC (A)
0.8
IC = 10 IB Ta = 25C Pulse
VBE(sat)
0.6
0.4 VCE = 2 V Ta = 25C Pulse 0.4 0.8 1.2 1.6 2.0
0.2
V CE
0.03 0.01 0.001 0.003 0.01 0.03
(sa
0
0.1
0.3
1.0
Base to Emitter Voltage VBE (V)
Collector Current IC (A)
Rev.2.00 Aug 10, 2005 page 3 of 5
2SD1974
DC Current Transfer Ratio vs. Collector Current
10,000 1.0 VCE = 2 V Pulse 25 Ta = 75C -25
Typical Characteristics of Emitter to Collector Diode
DC Current Transfer Ratio hFE
1,000 300 100 30
Diode Current ID (A)
3,000
0.8
0.6
0.4
0.2
Ta = 25C Pulse 0.4 0.8 1.2 1.6 2.0
10 0.001 0.003 0.01 0.03
0.1
0.3
1.0
0
Collector Current IC (A) Collector Output Capacitance vs. Collector to Base Voltage
Collector Output Capacitance Cob (pF)
1,000 300 100 30 10 3 1 0.3 Ta = 25C f = 1 MHz IE = 0
Emitter to Collector Forward Voltage VD (V)
1.0
3
10
30
Collector to Base Voltage VCB (V)
Rev.2.00 Aug 10, 2005 page 4 of 5
2SD1974
Package Dimensions
JEITA Package Code SC-62 RENESAS Code
PLZZ0004CA-A Package Name UPAK / UPAKV MASS[Typ.] 0.050g
Unit: mm
4.5 0.1
1.5 1.5 3.0
Ordering Information
Part Name 2SD1974ESTL-E Quantity 1000 Shipping Container 178 mm Reel, 12 mm Emboss Taping
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.2.00 Aug 10, 2005 page 5 of 5
0.8 Min
0.44 Max
(0.4)
0.53 Max 0.48 Max
(2.5)
1
2.5 0.1 4.25 Max
0.4
1.8 Max
1.5 0.1 0.44 Max
(1.5)
(0.2)
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


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